Laser Stencil are processed by laser cu ♣↕¥tting machines after directly outp∑‍↔utting CAD files from λ<'computers. They have the following ch₽ ↑₩aracteristics:

◆ High precision, ensuring both>​±φ the positional and dimensional acc♥∞uracy of the holes on the template. δ The laser machine itself has h ≈★igh precision, with X and Y axis ☆β'accuracy up to 3um (the highest prec"£'ision of domestic optical paint∏βing machines is 15um), and rep★‌÷etition accuracy up to≠≈§π 1um. Moreover, because the data is desΩ®£♦igned using computer≠× files and directly drive"♥±n by the computer, the possibility of ±©₽≥deviation in optical pai↕‌↔nting and graphic tran£¶ ✘sfer processes is reduced, especial'♣↔♠ly for large format ∞✘circuit boards. This ​✔advantage is even more prominent.

◆ The processing cycle♣> is short, with the ability​λ׶ to cut 6000 solder pads and up to 8φ ε€000 circular holes per hoπ™★ur. Data processing and machiφ±ning can be done in ↓™•±one go, and templates can beσγ§  easily obtained. Due >↓‍to the use of data-driven equi™$ pment for direct processiε♦ng, the process between design and maβ₽nufacturing is reduced, allowin™←₩Ωg for rapid response to the mark​γ₩Ωet.

◆ Plan control, good quality consi™★stency, not relying on complex chem→♣βical formulas and process parameteδ∑rs to control quality. Templat•∑€e production has almos•§©t no waste. Meanwhile, the use•> of laser template printing has λβa low defect rate, making it λ≈suitable for large-scale, automat♠$ λed SMT production needs.

◆ The hole wall is smooth, wit↑‌©h a roughness of less than¶' 3um. It can also be made small on€≠< the top and large on the botto∏±&βm by the beam focusing characteristic,↓≥λ< with a certain taper, which faci→<litates the release of solder paste. ∏✔↕The volume and shape ✘♣‌of solder paste applica↓β→tion can be controlled.

◆ No need for chemical solutions, ™γno need for chemical treatment, and ✔¥₽σno environmental pollu"→εtion.