Laser cutting of glass is ∞π←¶a stress cutting meth₩‌od that uses the abso‌ ∏rption of laser by the glass δ≤>to generate stress due to r✘®λ€apid local heating, resulting in c&™<racks caused by change∞‍s in stress and causing the glass to cr×‌ ack in the direction of laser$δ​♥ scanning. Its advantages are: small ↔♦α>cutting width, high pro±↑σ×cessing accuracy, sm₽↔ooth and neat cutting ‍♠surface, no need for subs☆→>☆equent processing, no micro ∑₩cracks, and fast processingφσ speed.

Processing capability:

Processing thickness: 0.1-2.5mm

Minimum aperture: 0.♥♥€1mm

Processing size: 300 × 500mm

Processing accuracy:+/±>επ- 0.005mm

Thickness to apertur€α§e ratio (width to thickness ratio): 10♣λ:1