Guanghong Laser Processing Cente  ‍r offers laser cutting of various ceram♦ ✘​ics, such as drilling o✔δ☆→r slotting holes in m∑♦✔ature ceramics and raw ceramic→ π"s.

Processing thickness: 0.05-2.5mm™÷$

Minimum opening ratio (β↓✔‍width to thickness ratio→✘) 1: one

Cutting edges without cracks or burr☆↓s

Fully automatic visual align& →εment ensures product processing accurac∏> y of+/-0.005mm

No burning or discoloration o$§βn the surface

Processing ceramic types:

LTCC Low Temperature Co fired Multilaye♣ r Ceramic Substrate (Raw α​↑Ceramic)

HTCC high-temperature co fired multi✘₽layer ceramics (mature ceramics)

DBC direct copper cerami™ αc substrate

DPC direct copper plated substrate