The COB Stencil is designed to £✔™™achieve good soldering effe←™<♣ct on other solder pads o✘←n PCB boards with bonding ICs. This t• "™ype of Stencil is integrally produce€‍‍d by electroplating method. In add≤÷ition to the advantages¶↑ of ordinary electroplating St≥©Ωγencils, the upper surfa←'↑$ce of the steel mesh at the locat∞ ≈βion of the bonding IC will pr÷&♥∞otrude, forming a hole, effectively ↓→©↓protecting the bonding IC from solde™≈£σring while ensuring that th€≠✘e steel mesh and solde$↕r pads at other locations are in close ♦α‍contact during the soldering process, t≤¶¶hus achieving good soldering e♦ &©ffect. It is best to use a rubb♠ ↕•er scraper for this typγ✔✔e of Stencil.