BGA rework fixture is an auxα≤≠€iliary tool used in the rework"σ∑ process of BGA (Ball Grid Array) ©♥¶÷packaged chips, primarily for precise≤&♦δ positioning, securing, and proγσtecting BGA chips to enhance rework "↕success rates and minimize ∑₽πdamage to surrounding componλ∑δ↑ents and circuit boa σrds. 

Here is a detailed introductiα↕₽on:

Structure and Features

• Precise Positioning: By aligni ® ng with specific holes or outline β ♦contours on the circui§ t board, it accurately places theδα BGA chip in the correε£ct position, ensuring the chip's p¥≠$ins align perfectly with t∑₹he board's pads.

• Secure Fixation: Ut♠♣ilizes various securing methods,≥< such as clamps and ₩"pressure blocks, to fir↔ mly hold the BGA chip and circuit bo♣♥ard in place, preventing mβ ovement during rework and ensuεβ± ring welding quality.

• High Temperature Resistance: MaΩ™>de from high-temperature ∑÷•'resistant materials li♥✘‍‍ke ceramic or special plastics, the ≤<fixture withstands the high temp♣✘₹eratures of soldering without def✔≤σorming, maintaining its precisi→β±‌on and performance.

• Good Compatibility: Some BGA r'γ≠πework fixtures are desig♦‍ned with adjustable or modular s≈★$tructures, allowing different pos' ✘itioning modules or adju∏‍αstable clamp sizes to accommodate vario÷​®us BGA chip sizes and pac♦€•kage forms, offering hi‍™∏gh versatility.

Functions

• Assists in Soldering: Duriφ₽<ng the desoldering and soldering of BG• A chips, the fixture ensures the₩β relative position between the chip andλ< the circuit board remains uncελ✔hanged, allowing sol÷¶der to melt and solidify evenly, f ©orming good solder joints and reducing¶₽  issues like cold solde‍♠×r joints and short circ✔→uits.

• Protects Surrounding Componen Ω↓ts: During rework, the f™♥>ixture can shield or isolate s↕♠Ωurrounding components, ♣§preventing them from being affecte ‌γd by high-temperature aδ∏&irflows or soldering iron tips,♦₹★✘ thus avoiding damage or perfor​∑Ωmance degradation due to o £αverheating.

• Enhances Work Efficiency: Using © >the fixture makes rewo☆↓¥$rk operations more standardiz‌≈&™ed and convenient, reducing≥>λ the time needed for ↔✘manual alignment and securi£'ng of chips, thereby>₽→₩ improving rework efficiency ≥∏‍÷and lowering the skill r '∑equirements for operators€₹π.

The BGA rework fixture ♣‍λ∏is an indispensable to±∑∏$ol in the electronics manuf‍↕©acturing and repair field, pla✔ε​ying a crucial role in enhancin≈>←g the quality and efficien♠>cy of BGA chip rework.