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AI adhesive  stencil
AI adhesive  stencil
AI adhesive stencil
This type of template is spe'₽≤cifically developed and designed for€©¶ the PCBA production proc↔☆÷ess of first inserting ≥→≥<and then mounting, to replace dispensiΩ₽¶ng machines and improδ×♥₽ve the efficiency of mass pro≥↔duction. Hollow out the bo₹ ¥ttom of the template whe→λ£✘re there are upper pins on the P←∏ βCBA to avoid the pins and ensure ti≤>ght contact between the £δtemplate and the PCB during the sol↓ φder paste printing process.
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This type of template is spφ ¶₩ecifically developed an®Ω""d designed for the PCBA p♥¶Ωroduction process of first insertinγ &↑g and then mounting, t&÷∑o replace dispensing machines an₽♠d improve the efficiency of  ♠εmass production. Hollow out$∏ the bottom of the templ•§♣ate where there are upσ₽λper pins on the PCBA to avoi ©d the pins and ensure tightα∏ contact between the te→ ♠×mplate and the PCB durβ•<ing the solder paste printiα₹¶ng process.

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